Structural analysis of CuInSe2 thin films prepared by selenization of Cu-In films
Identifieur interne : 000020 ( Main/Exploration ); précédent : 000019; suivant : 000021Structural analysis of CuInSe2 thin films prepared by selenization of Cu-In films
Auteurs : RBID : ISTEX:10854_1996_Article_BF00225630.pdfAbstract
This study involves the characterization of thin films of copper indium diselenide (CuInSe2) deposited on soda-lime glass substrates using a two-step process. In this technique electron-beam-evaporated Cu-In precursor layers were reacted with an atmosphere containing H2Se gas. The morphological and structural aspects of the CuInSe2 layers were studied (by scanning electron microscopy and X-ray diffraction) as a function of the Cu-In film morphology and the selenization temperature profile and exposure time. It was found that the Cu-In precursor morphology has a significant influence on the structural properties of the final CuInSe2 film. Selenization of the Cu-In alloys (irrespective of the structure considered) directly at high temperature resulted in films with poor structural properties. However, a vast improvement in the adhesion properties and morphology of the CuInSe2 films were observed when the Cu-In films were exposed to a reactive selenium atmosphere while ramping the temperature between 150 ‡C and 400 ‡C. Selenization of triple-layer structures (Cu/In/Cu and In/Cu/In) resulted in films with good structural properties and excellent compositional uniformity.
DOI: 10.1007/BF00225630
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<author><name>R. Swanepoel</name>
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<front><div type="abstract" xml:lang="eng">This study involves the characterization of thin films of copper indium diselenide (CuInSe2) deposited on soda-lime glass substrates using a two-step process. In this technique electron-beam-evaporated Cu-In precursor layers were reacted with an atmosphere containing H2Se gas. The morphological and structural aspects of the CuInSe2 layers were studied (by scanning electron microscopy and X-ray diffraction) as a function of the Cu-In film morphology and the selenization temperature profile and exposure time. It was found that the Cu-In precursor morphology has a significant influence on the structural properties of the final CuInSe2 film. Selenization of the Cu-In alloys (irrespective of the structure considered) directly at high temperature resulted in films with poor structural properties. However, a vast improvement in the adhesion properties and morphology of the CuInSe2 films were observed when the Cu-In films were exposed to a reactive selenium atmosphere while ramping the temperature between 150 ‡C and 400 ‡C. Selenization of triple-layer structures (Cu/In/Cu and In/Cu/In) resulted in films with good structural properties and excellent compositional uniformity.</div>
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<abstract lang="eng">This study involves the characterization of thin films of copper indium diselenide (CuInSe2) deposited on soda-lime glass substrates using a two-step process. In this technique electron-beam-evaporated Cu-In precursor layers were reacted with an atmosphere containing H2Se gas. The morphological and structural aspects of the CuInSe2 layers were studied (by scanning electron microscopy and X-ray diffraction) as a function of the Cu-In film morphology and the selenization temperature profile and exposure time. It was found that the Cu-In precursor morphology has a significant influence on the structural properties of the final CuInSe2 film. Selenization of the Cu-In alloys (irrespective of the structure considered) directly at high temperature resulted in films with poor structural properties. However, a vast improvement in the adhesion properties and morphology of the CuInSe2 films were observed when the Cu-In films were exposed to a reactive selenium atmosphere while ramping the temperature between 150 ‡C and 400 ‡C. Selenization of triple-layer structures (Cu/In/Cu and In/Cu/In) resulted in films with good structural properties and excellent compositional uniformity.</abstract>
<relatedItem type="series"><titleInfo type="abbreviated"><title>J Mater Sci: Mater Electron</title>
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<titleInfo><title>Journal of Materials Science: Materials in Electronics</title>
<partNumber>Year: 1996</partNumber>
<partNumber>Volume: 7</partNumber>
<partNumber>Number: 2</partNumber>
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<subject usage="primary"><topic>Engineering</topic>
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<identifier type="issn">0957-4522</identifier>
<identifier type="issn">Electronic: 1573-482X</identifier>
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<part><extent unit="pages"><start>91</start>
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